DiffChip: Thermally Aware Chip Placement with Automatic Differentiation
- Giuseppe Romano
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Publications
8 results at ECTC 2025
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
Fully Encapsulated Fine Pitch Dual Damascene Organic RDL with Low Dk Df Photosensitive Polyimide and Its Reliability
- Minhua Lu
- Joyce Liu
- et al.
- 2025
- ECTC 2025
Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John Knickerbocker
- Jean Benoit Heroux
- et al.
- 2025
- ECTC 2025
Fast And Accurate Machine Learning Prediction of Back-End-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Self-Alignment of active Si Bridge using solder joint capillary forces
- Thomas Lesueur
- David Danovitch
- et al.
- 2025
- ECTC 2025
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Zerey
- Alina Bennett-dubin
- et al.
- 2025
- ECTC 2025
Graphite sheet embedded in an organic flip-chip package for heat spreading
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- ECTC 2025