Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives
- Ravi F. Saraf
- Judith M. Roldan
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Publications
13 results at IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Improvements in Index Alignment Method for Laser-Fiber Array Packaging
- M.S. Cohen
- M.J. DeFranza
- et al.
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Estimating the Dynamic Behavior of Printed Circuit Boards
- Arturo O. Cifuentes
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B