Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
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3 results for Daehyun Chung
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
- Tapobrata Bandyopadhyay
- Ki Jin Han
- et al.
- 2011
- IEEE Transactions on CPMT