Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
- Biancun Xie
- Madhavan Swaminathan
- et al.
- 2011
- EMC 2011
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Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009