Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
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Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
- Keiji Matsumoto
- Marc Bergendahl
- et al.
- 2021
- ECTC 2021