Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
- Myung-Jin Yim
- Kyung-Wook Paik
- 2001
- IEEE Transactions on Components and Packaging Technologies
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.