Comparison of electromigration in Cu interconnects with ALD or PVD TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- ECS Meeting 2006
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2 results for S.L. Liew
Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- JES