Wiring and crosstalk avoidance in multi-chip module design

Abstract

This paper presents a channel-based thin-film wiring methodology for multi-chip module design. Crosstalk between adjacent transmission lines are specifically calculated and minimized during routing to avoid excessive coupled noises being propagated from the driver to the receivers. On a benchmark TCM module with 124 chips, this special wiring technique completes 42,044 connections on two thin-film layers and satisfies all wire length restrictions and noise limits. © 1992 IEEE.