Alexander Miessen
QSim 2024
We describe design, implementation, and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling, and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of the system and present measurements of flux tunable qubits with an average T1 = 84 μs and T2echo=134 μs after vacuum-loading these samples into a bottom loading dilution refrigerator in the UHV-package.
Alexander Miessen
QSim 2024
Dennis Wang, Priti Shah, et al.
APS March Meeting 2021
Andreas Fuhrer, M. Aldeghi, et al.
IEDM 2022
Daniel J. Egger, Marc Ganzhorn, et al.
Physical Review Applied