Dong G. Kam, Troy J. Beukema, et al.
DesignCon 2008
To address the abating performance improvements from device scaling, innovative 2.5-D and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) have been widely explored. This paper reviews TSVs with focus on the following: 1) key drivers for TSV-based integration; 2) TSV fabrication techniques; 3) TSV electrical and thermomechanical performance fundamentals and characterization techniques; and 4) novel technologies to attain enhanced performance beyond the state-of-the-art TSVs.
Dong G. Kam, Troy J. Beukema, et al.
DesignCon 2008
Leung Tsang, Henning Braunisch, et al.
IEEE Transactions on Advanced Packaging
Timothy O. Dickson, Yong Liu, et al.
VLSI Circuits 2011
Xiaoxiong Gu, Albert E. Ruehli, et al.
EPEPS 2008