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Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
PaperSoft x-ray investigation of the effect of growth conditions on InAs/GaAs heterostructuresA. Krol, C.J. Sher, et al.Surface Science
