User's perspective of optoelectronic integration
J.D. Crow
IEE/LEOS Summer Topical Meetings 1990
Thermal resistance and crosstalk have been investigated for a source package consisting of a monolithic, multilaser heterojunction array mounted on a single crystalline silicon substrate, which is in turn laminated to a copper heatsink. Models for 2-D and 3-D heat spreading are used to calculate the heat flow distribution and to obtain upper and lower bounds for both resistance of single devices and crosstalk in arrays. Results for experimental five-laser arrays are shown to fall within these limits. Active cooling is required to maintain junctions at safe operating temperatures prerequisite to stable, long-lived operation. © 1978 Optical Society of America.
J.D. Crow
IEE/LEOS Summer Topical Meetings 1990
J.D. Crow
ECTC 1989
H. Franke, J.D. Crow
Proceedings of SPIE 1989
D. Kuchta, J.D. Crow, et al.
MPPOI 1998