Conference paper
Thermal stress evaluation of a PCRAM material Ge2Sb 2Te5
K.N. Chen, L. Krusin-Elbaum, et al.
NVSMW 2006
Thermal expansion of the isostructural PtSi and NiSi was studied. NiSi displayed the rare occurrence of contracting during heating along the axis with the smallest unit cell dimension. It was shown that NiSi was reproducible in thin films prepared by reactive diffusion. Expansion or contraction along the axis with small dimensions during heating was not shown in PtSi. Presence of residual thermal stresses at low temperatures was not revealed by X-ray diffraction in PtSi films.
K.N. Chen, L. Krusin-Elbaum, et al.
NVSMW 2006
F.M. D'Heurle, A. Gangulee
Thin Solid Films
C. Coïa, C. Lavoie, et al.
ECS Meeting 2005
S.-L. Zhang, F.M. D'Heurle
Applied Physics Letters