Conference paper

01 Jan 1991

The study of the Cu/Al/Au thin film system by electron microscopy

Paper

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, Peter M. Fryer, et al.

Journal of Applied Physics

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Effects of substrate temperature on copper distribution, resistivity, and microstructure in magnetron-sputtered Al-Cu films

K.Y. Ahn, T. Lin, et al.

Thin Solid Films

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Stresses and radiation damage in Ar⁺ and Ti⁺ ion-implanted silicon

P.B. Madakson, J. Angilello

Journal of Applied Physics

Paper

Characterization of CVD-hydrogenated diamondlike thin films on silicon by EELS, RBS/channeling and nuclear reaction analysis

J. Bruley, P.B. Madakson, et al.

Nuclear Inst. and Methods in Physics Research, B

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