Conference paper

01 Jan 1991

The study of the Cu/Al/Au thin film system by electron microscopy

Paper

Effects of substrate temperature on copper distribution, resistivity, and microstructure in magnetron-sputtered Al-Cu films

K.Y. Ahn, T. Lin, et al.

Thin Solid Films

Paper

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, Peter M. Fryer, et al.

Journal of Applied Physics

Paper

Relationship between substrate bias and microstructure in magnetron-sputtered AlCu films

T. Lin, K.Y. Ahn, et al.

Thin Solid Films

Paper

Stresses and radiation damage in Ar⁺ and Ti⁺ ion-implanted silicon

P.B. Madakson, J. Angilello

Journal of Applied Physics

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