Conference paper
Learning Reduced Order Dynamics via Geometric Representations
Imran Nasim, Melanie Weber
SCML 2024
The microstructures of Hf/Al(Cu) and Ti/Al(Cu) bilayers have been investigated using transmission electron microscopy. Both flat-on and cross-sectional techniques were used to study the effects of annealing and Cu addition on the grain structure and interfacial morphology. While the Al-Hf system exhibits irregular morphology with spike formation, which becomes smoother with Cu addition, the Al-Ti system has significantly smoother morphology with or without Cu addition. © 1987, The Electrochemical Society, Inc. All rights reserved.
Imran Nasim, Melanie Weber
SCML 2024
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
E. Burstein
Ferroelectrics
Ellen J. Yoffa, David Adler
Physical Review B