Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperShear and time-dependent rheology of a fully nematic thermotropic liquid crystalline copolymerDouglass S. Kalika, David W. Giles, et al.Journal of Rheology
TalkEnhanced Room Temperature Photoluminescence Quantum Yield in Morphology-Controlled J-AggregatesSurendra B. Anantharaman, Joachim Kohlbrecher, et al.MRS Fall Meeting 2020