Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits

G. Ramanath; G. Cui; P.G. Ganesan; X. Guo; A.V. Ellis; M. Stukowski; K. Vijayamohanan; P. Doppelt; M.W. Lane

doi:10.1063/1.1591232

Applied Physics Letters

Paper

08 Jul 2003

Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits

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Abstract

Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits were investigated. Self-assembled monolayers (SAMs) ∼0.7 nm-thick enhanced adhesion and inhibited Cu diffusion at Cu/SiO2 structures. Cu/SAM/SiO2/Si(001) structures showed three times higher interface debond energy compared to Cu/SiO2 interfaces.

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