P.G. Ganesan, G. Cui, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits were investigated. Self-assembled monolayers (SAMs) ∼0.7 nm-thick enhanced adhesion and inhibited Cu diffusion at Cu/SiO2 structures. Cu/SAM/SiO2/Si(001) structures showed three times higher interface debond energy compared to Cu/SiO2 interfaces.
P.G. Ganesan, G. Cui, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
D.D. Gandhi, A.P. Singh, et al.
Journal of Applied Physics
D.D. Gandhi, B. Singh, et al.
Journal of Applied Physics
P.G. Ganesan, G. Cui, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures