Conference paperOptical measurement of internal logic patterns in a flip-chip mounted silicon SRAM integrated circuitH. Heinrich, N. Pakdaman, et al.LEOS 1992
Conference paperPerformance of In0.53Ga0.47As metal-semiconductor-metal photodetectors at 1.55 μmF. Tong, D.T. McInturff, et al.LEOS 1992
PaperA High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump TechnologyK. Jackson, E.B. Flint, et al.Journal of Lightwave Technology
PaperWide band home phone line characterizationD. Liu, E.B. Flint, et al.IEEE Transactions on Consumer Electronics
