About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEDM 2013
Conference paper
Self-aligned III-V MOSFETs: Towards a CMOS compatible and manufacturable technology solution
Abstract
We demonstrate self-aligned fully-depleted III-V MOSFETs using CMOS-compatible device structures and manufacturable process flows. Processes with good manufacturability and scalability, such as, gate definition and spacer formation using RIE, and formation of self-aligned source/drain extensions (SDE) and self-aligned raised source/drain (RSD), have been established on III-Vs. We demonstrate short-channel devices down to gate length LG = 30 nm. Our best short-channel devices exhibit peak saturation transconductance GMSAT = 1140 μS/μm at LG = 60 nm and supply voltage VDD = 0.5 V. © 2013 IEEE.