Polymer/metal composite for interconnection technology

Abstract

The rheological, electrical and mechanical properties of a paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent from the paste has dried are reported. The paste properties indicate the applicability of the material for fine feature size interconnects such as required for flip-chip-attach. The adhesive and electrical properties of PMC demonstrates that this materials will be suitable as an interconnect media in high performance applications. Furthermore, the system chosen is reworkable and the bonding process is volatile-free and allows the solvent to be completely removed prior to the bonding step.