Fuad E. Doany, Clint L. Schow, et al.
SPIE IOPTO 2008
To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.
Fuad E. Doany, Clint L. Schow, et al.
SPIE IOPTO 2008
Jessie C. Rosenberg, Folkert Horst, et al.
ECOC 2017
E. Bosman, G. Van Steenberge, et al.
SPIE OPTO 2016
Elger A. Vlieg, Roger Dangel, et al.
IEEE JSTQE