L. Jiang, Barry J. Rubin, et al.
IEEE Topical Meeting EPEPS 2006
A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory. © 2007 IEEE.