Conference paperAnalysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designsYibo Chen, Eren Kursun, et al.ISLPED 2011
PaperEnergy-aware accounting and billing in large-scale computing facilitiesVíctor Jiménez, Francisco J. Cazorla, et al.IEEE Micro
Conference paperThermomechanical stress-aware management for 3D IC designsQiaosha Zou, Tao Zhang, et al.DATE 2013
Conference paperPower-efficient, reliable microprocessor architectures: Modeling and design methodsPradip Bose, Alper Buyuktosunoglu, et al.GLSVLSI 2010