Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT
Conference paper
On adding metalization to improve via performance on PCBs
Abstract
The design of printed circuit boards evolves continuously in density, price and performance. In this short paper, we propose an approach where the performance of a via is altered by adding additional metalizations to enhance the ground return path for signals. ©2009 IEEE.
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