PublicationJournal of Materials ResearchPaperNickel-alloyed tin-lead eutectic solder for surface mount technologyJournal of Materials ResearchView publicationAbstractNo abstract available.Home↳ PublicationsDate01 Jan 1993PublicationJournal of Materials ResearchAuthorsSung K. KangThomas G. FerenceIBM-affiliated at time of publicationTopicsPhysical SciencesMaterials DiscoveryShare
