Shiyi Chen, Daniel Martínez, et al.
Physics of Fluids
The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.
Shiyi Chen, Daniel Martínez, et al.
Physics of Fluids
Sung Ho Kim, Oun-Ho Park, et al.
Small
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science