Kigook Song, Robert D. Miller, et al.
Macromolecules
The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.
Kigook Song, Robert D. Miller, et al.
Macromolecules
Oliver Schilter, Alain Vaucher, et al.
Digital Discovery
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures