Material and process for advanced Cu/ULK integration
Chih-Chao Yang, Daniel C. Edelstein, et al.
ADMETA 2008
The ability to prepare multiple cross-section transmission electron microscope (XTEM) samples from one XTEM sample of specific sub-10 nm features was demonstrated. Sub-10 nm diameter Si nanowire (NW) devices were initially cross-sectioned using a dual-beam focused ion beam system in a direction running parallel to the device channel. From this XTEM sample, both low- and high-resolution transmission electron microscope (TEM) images were obtained from six separate, specific site Si NW devices. The XTEM sample was then re-sectioned in four separate locations in a direction perpendicular to the device channel: 90° from the original XTEM sample direction. Three of the four XTEM samples were successfully sectioned in the gate region of the device. From these three samples, low- and high-resolution TEM images of the Si NW were taken and measurements of the NW diameters were obtained. This technique demonstrated the ability to obtain high-resolution TEM images in directions 90° from one another of multiple, specific sub-10 nm features that were spaced 1.1 μm apart. © Copyright Microscopy Society of America 2011.
Chih-Chao Yang, Daniel C. Edelstein, et al.
ADMETA 2008
Shimon Levi, Ishai Schwarzband, et al.
SPIE Advanced Lithography 2014
Oliver C. Wells, Michael S. Gordon, et al.
ScMi 2012
Guy M. Cohen, Leathen Shi, et al.
ASMC 2014