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Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
Conference paperIntegration of polymer self-assembly for lithographic applicationJoy Y. Cheng, Daniel P. Sanders, et al.SPIE Advanced Lithography 2008
PaperBrillouin scattering investigation of paraelectric KH2PO4 near the tricritical pointR.W. Gammon, E. Courtens, et al.Physical Review B
