PaperSilylation of resist materials using di- and polyfunctional organosilicon compoundsE. Babich, J. Paraszczak, et al.Microelectronic Engineering
Conference paperHigh performance dielectrics and processes for ULSI interconnection technologiesJ. Paraszczak, D. Edelstein, et al.IEDM 1993
PaperMechanism of oxygen plasma etching of polydimethyl siloxane filmsN.J. Chou, C.H. Tang, et al.Applied Physics Letters