Abstract
Magnetic field enhanced reactive ion etching of polyimide was investigated using a planar magnetron discharge. Etch studies were conducted with various gas composition, power, and pressure conditions. Etch rates of fully cured polyimide up to 2.5 μm/min were achieved in an oxygen plasma at 6.65 Pa with cathode voltage of about — 200 V. The etching nonuniformity caused by localized magnetic field was found to be pressure dependent. Relative motion between the substrates and the magnet assembly improved the uniformity. Patterning of polyimide was achieved by using both erodible and nonerodible masks. © 1984, American Vacuum Society. All Rights Reserved.