Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperScanning tunneling microscopy and spectroscopy of thin metal films on the GaAs(110) surfaceP. Martensson, R.M. FeenstraJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
