LCVD of copper: Deposition rates and deposit shapes

Abstract

Laser chemical vapor deposition of copper has been performed under a variety of conditions. The results are interpreted using the kinetic model of Ehrlich and Tsao. We find that the kinetics of the process are limited by the rates of surface reactions and not by diffusion of reactant molecules to the surface. Furthermore, we find that deposit shapes are quite sensitive to laser intensity and scan rate. © 1986 Springer-Verlag.