Layer misregistration in PCB and its effects on signal propagation

Abstract

Layer misregistration is one of the common issues in PCB manufacturing processes. In addition to physical limitations of manufacturability (large via pad/anti-pad), it may also have impact on the electrical performance of signal lines running through via fields with anti-pad openings. In order to quantify its effects on signal propagation, comprehensive test vehicles were designed, measured, and analyzed. Significant increases in layer-to-layer crosstalk and common-to-differential mode conversion were observed, when corresponding layers were misaligned. The results helped understand the mechanisms, validate modeling methodology, and define design rules. © 2010 IEEE.