Publication
ECTC 2010
Conference paper

Layer misregistration in PCB and its effects on signal propagation

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Abstract

Layer misregistration is one of the common issues in PCB manufacturing processes. In addition to physical limitations of manufacturability (large via pad/anti-pad), it may also have impact on the electrical performance of signal lines running through via fields with anti-pad openings. In order to quantify its effects on signal propagation, comprehensive test vehicles were designed, measured, and analyzed. Significant increases in layer-to-layer crosstalk and common-to-differential mode conversion were observed, when corresponding layers were misaligned. The results helped understand the mechanisms, validate modeling methodology, and define design rules. © 2010 IEEE.

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Publication

ECTC 2010

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