Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
PaperElectron and positron channeling radiation from beryllium oxideH.D. Dulman, R.H. Pantell, et al.Physical Review B
