High-speed aqueous-developing negative resist based on triflic-acid-catalyzed epoxy polymerization

Abstract

The need for higher resolution is a continuing driving force in the development of new lithographic materials. In this paper we discuss a new high speed, high resolution negative photoresist based on acid catalyzed epoxy polymerization. These materials are copolymers of two monomers that each provide a separate function in the photoresist. This combination provides a unique new material with aqueous processability in metal ion-free developers and high sensitivity to photogenerated triflic acid. Imaging characteristics in electron beam and i-line exposure systems are discussed.