J.M.E. Harper, C. Cabral Jr., et al.
Journal of Applied Physics
Paper
High energy BSE/SE/STEM imaging of 8 um thick semiconductor interconnects
Abstract
No abstract available.
Related
L. Gignac, T.M. Parrill, et al.
Thin Solid Films
Conference paper
Electromigration reliability in nanoscale Cu interconnects
C.-K. Hu, L. Gignac, et al.
MRS Fall Meeting 2007
Conference paper
Electromigration Cu mass flow in Cu interconnections
C.-K. Hu, D. Canaperi, et al.
Thin Solid Films