Conference paperA study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH zC.-K. Hu, D. Canaperi, et al.AMC 2003
PaperThe microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu linesK.P. Rodbell, L. Gignac, et al.Journal of Applied Physics
Conference paperCharacterization of plated Cu thin film microstructuresL. Gignac, K.P. Rodbell, et al.MRS Spring Meeting 1999
ReviewEffect of metal liner on electromigration in Cu Damascene linesC.-K. Hu, L. Gignac, et al.Journal of Applied Physics