Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2009
Directed placement of solution-based nanomaterials at predefined locations with nanoscale precision limits bottom-up integration in semiconductor process technology. We report a method for electric-field-assisted placement of nanomaterials from solution by means of large-scale graphene layers featuring nanoscale deposition sites. The structured graphene layers are prepared via either transfer or synthesis on standard substrates, and then are removed once nanomaterial deposition is completed, yielding material assemblies with nanoscale resolution that cover surface areas >1 mm2. In order to demonstrate the broad applicability, we have assembled representative zero-dimensional, one-dimensional, and two-dimensional semiconductors at predefined substrate locations and integrated them into nanoelectronic devices. Ultimately, this method opens a route to bottom-up integration of nanomaterials for industry-scale applications.
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2009
Shu Jen Han, Jianshi Tang, et al.
Nature Nanotechnology
Michael Engel, Mathias B. Steiner
SPIE Optics + Photonics 2019
Chun Yung Sung, Yu-Ming Lin, et al.
VLSI-TSA 2010