Future packaging materials: Cost performance, and environmental issues

L.L. Kosbar, J. Gelorme

Journal of Engineering and Applied Science

D.Y. Shih, Brian Beaman, et al.

ECTC 1995

K.J. Stewart, M. Hatzakis, et al.

Polymer Engineering & Science

K.L. Lee, J. Bucchignano, et al.

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures