A shorted global clock design for multi-GHz 3D stacked chips
Liang-Teck Pang, Phillip J. Restle, et al.
VLSI Circuits 2012
With the advances in the speed of high-performance chips, inductance effects in some on-chip interconnects have become significant. Specific networks such as clock distributions and other highly optimized circuits are especially impacted by inductance. Several difficult aspects have to be overcome to obtain valid waveforms for problems where inductances contribute significantly. Mainly, the geometries are very complex and the interactions between the capacitive and inductive currents have to be taken into account simultaneously. In this paper, we show that a full-wave partial element equivalent circuit method, which includes the delays among the partial elements, leads to an efficient solver enabling the analysis of large meaningful problems. Applying this method to several examples leads to helpful insights for realistic very large scale integration wiring problems. It is shown in this paper that the impact overshoot, reflections, and inductive coupling are critical for the design of critical on-chip interconnects.
Liang-Teck Pang, Phillip J. Restle, et al.
VLSI Circuits 2012
Giulio Antonini, Jonas Ekman, et al.
IEEE Topical Meeting EPEPS 2007
Ibrahim M. Elfadel, Hao-Ming Huang, et al.
IEEE Transactions on Advanced Packaging
Bruce Archambeault, Albert E. Ruehli
Journal of The Japan Institute of Electronics Packaging