Conference paper
Pb-free solder alloys for flip chip applications
S.K. Kang, J. Horkans, et al.
ECTC 1999
A stable shell of YBa2Cu4O8 (124) forms in powder and sintered bulk YBa2Cu3O7-δ (123) superconducting oxides upon oxygen outdiffusion from the latter and serves as a diffusion barrier to retard further oxygen outdiffusion. The 124 phase formation has been investigated by thermogravimetric analysis and x-ray diffraction. The better thermal stability of the 124 phase can be explained by the stronger bonding configuration of O(1) atoms in a double-chain structure.
S.K. Kang, J. Horkans, et al.
ECTC 1999
J.W. Mayer, S.S. Lau, et al.
Journal of Applied Physics
R.R. Yu, F. Liu, et al.
VLSI Technology 2009
G. Ottaviani, K.N. Tu, et al.
Journal of Applied Physics