Photonic components for short range optical interconnects
Bert Jan Offrein
CLEO 2008
A scalable and tolerant optical interfacing method based on flipchip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of ± 2 μm. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70°C. © 2013 Optical Society of America.
Bert Jan Offrein
CLEO 2008
Laura Bégon-Lours, Mattia Halter, et al.
Neuromorph. Comput. Eng.
Jan-Marc Lehky, Daniel Erni, et al.
LEOS 2005
Jens Hofrichter, Antonio La Porta, et al.
OI 2012