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Paper
Electromigration resistant power delivery systems
Abstract
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system. © 2007 IEEE.