Carla Agurto Rios, Eduardo Castro, et al.
ICDH 2025
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system. © 2007 IEEE.
Carla Agurto Rios, Eduardo Castro, et al.
ICDH 2025
Klaus Ruhmer, Emmett Hughlett, et al.
EPTC 2007
Chirag S. Patel, Paul S. Andry, et al.
IITC 2005
Katsuyuki Sakuma, Paul S. Andry, et al.
IBM J. Res. Dev