PublicationADMETA 2010Conference paperEffective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)ADMETA 2010AbstractNo abstract available.Home↳ PublicationsDate01 Dec 2010PublicationADMETA 2010AuthorsF. ItoH. ShobhaM. TagamiTakeshi NogamiS. CohenY. OstrovskiSteven MolisK. MaloneyJ. FemiakJ. ProtzmanTeresa PintoE.T. RyanA. MadanC.-K. HuT. SpoonerIBM-affiliated at time of publicationTopicsPhysical SciencesShare