Conference paper
Injection molded solder technology for Pb-free wafer bumping
P. Gruber, D.Y. Shih, et al.
ECTC 2004
Contaminants introduced during polyimide (PI) processing cause open and short circuit defects of multichip glass ceramic modules (MCM-D). Fibers, metal flakes, particles and polishing scratches expose the PI to the hot N-methylpyrollidinone (NMP) solvent which diffuses to the polyimide/copper wiring structures causing them to swell. The amount of damage depends on the rate of solvent diffusion, process temperature, lift-off time and the amount of PI swelling during processing.
P. Gruber, D.Y. Shih, et al.
ECTC 2004
A. Deutsch, G.V. Kopcsay, et al.
SPIE Advances in Intelligent Robotics Systems 1990
D.Y. Shih, J. Paraszczak, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
S.K. Kang, D.Y. Shih, et al.
ECTC 2001