With SiGe, who needs GaAs?
T.H. Ning
COMMAD 1998
In order to realize the full performance potential of bipolar devices in scaling, the vertical dimensions, i. e. base width, epi thickness, etc. , must be reduced in a coordinated manner with the horizontal dimensions. Current gains of three bipolar transistors having identical shallow emitter and base profiles but different emitter contacts are presented. The large current gain provided by the polysilicon emitter contact allows bipolar transistors to be scaled down to submicron dimensions without having to worry about emitter-collector punch through problems. Potential problems due to interfacial layers can be monitored by monitoring the emitter series resistance, which can be determined from the measured I-V characteristics, and then plotted as shown.
T.H. Ning
COMMAD 1998
G. Shahidi, B. Bucclot, et al.
VLSI Technology 1992
T.H. Ning
Microelectronics and VLSI, TENCON 1995
Subramanian S. Iyer, C.-Y. Ting, et al.
VLSI Science and Technology 1983