Dual grid array antennas in a thin-profile package for flip-chip interconnection to highly integrated 60-GHz radios

Abstract

We examine the current development of highly integrated 60-GHz radios with an interest in antenna-circuit interfaces. We design and analyze grid array antennas with special attention to the differential feeding and the patterned ground plane. More importantly, we integrate two grid array antennas in a package; propose the way of assembling it to the system printed circuit board; and demonstrate a total solution of low cost and thin profile to highly integrated 60-GHz radios. We show that the package in low temperature cofired ceramic (LTCC) technology measures only 13 × 13 × 0.575 mm 3; can carry a 60-GHz radio die of current and future sizes with flip-chip bonding; and achieves good antenna performance in the 60-GHz band with maximum gain of 13.5 and 14.5 dBi for the single-ended and differential antennas, respectively. © 2006 IEEE.