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PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperGlassy behaviour in high-Tc superconductorsI. Morgenstern, K.A. Müller, et al.Physica B: Physics of Condensed Matter
