PublicationADMETA 2010Conference paperCopper microstructure: Effect on electromigration void evolutionADMETA 2010AbstractNo abstract available.Home↳ PublicationsDate01 Dec 2010PublicationADMETA 2010AuthorsC. WittV. CaleroC.-K. HuF. FeustelG. BonillaIBM-affiliated at time of publicationTopicsPhysical SciencesShare