Ming L. Yu, Kie Y. Ahn, et al.
Journal of Applied Physics
Methods of reducing Hc in thick NiFe films deposited on evaporated Au have been studied for applications in conductor-first single-level masking bubble device fabrication. Results obtained using surface modification techniques, such as ion implantation, plasma etching, and semiconducting intermediate layers (TiOx) are described. In addition, the performance of actual 5-μm and 2-μm devices is discussed. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.