L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
In 3-D chip stacks, the electronic design may lead to a variety of different hot-spot scenarios and through-silicon-via (TSV) arrangements and distributions. In the present work, the influence and implications of the integrated water-cooling, TSV distribution, and size on the control of inhomogeneous hot-spots in such stacks is investigated. The numerical model consists of a row of 50 inline cylindrical micropin fins (of different size) inside a microcavity. Material properties are modeled as temperature-dependent, and the Reynolds number ranges from 60 to 180. An optimal design of hot-spots arrangements and TSV sizes is found to reduce the maximal temperature in the chip by up to 20%, and increase the average heat transfer by up to 30%. © 2014 Copyright Taylor and Francis Group, LLC.
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
A. Reisman, M. Berkenblit, et al.
JES